Just Simply TQM Systems



In electronic devices, printed circuit boards, or PCBs, are utilized to mechanically support electronic elements which have their connection leads soldered onto copper pads in surface area mount applications or through rilled holes in the board and copper pads for soldering the part leads in thru-hole applications. A board style may have all thru-hole components on the top or element side, a mix of thru-hole and surface area mount on the top side only, a mix of thru-hole and surface install elements on the top side and surface area mount components on the bottom or circuit side, or surface mount parts on the top and bottom sides of the board.

The boards are also utilized to electrically link the needed leads for each component utilizing conductive copper traces. The element pads and connection traces are etched from copper sheets laminated onto a non-conductive substrate. Printed circuit boards are created as single agreed copper pads and traces on one side of the board just, double sided with copper pads and traces on the top and bottom sides of the board, or multilayer designs with copper pads and traces on the top and bottom of board with a variable variety of internal copper layers with traces and connections.

Single or double sided boards include a core dielectric material, such as FR-4 epoxy fiberglass, with copper plating on one or both sides. This copper plating is engraved away to form the actual copper pads and connection traces on the board surfaces as part of the board manufacturing procedure. A multilayer board consists of a variety of layers of dielectric material that has actually been fertilized with adhesives, and these layers are utilized to separate the layers of copper plating. All of these layers are lined up and then bonded into a single board structure under heat and pressure. Multilayer boards with 48 or more layers can be produced with today's innovations.

In a typical 4 layer board style, the internal layers are frequently utilized to offer power and ground connections, such as a +5 V airplane layer and a Ground airplane layer as the 2 internal layers, with all other circuit and component connections made on the top and bottom ISO 9001 Certification Consultants layers of the board. Extremely complex board designs might have a a great deal of layers to make the different connections for different voltage levels, ground connections, or for linking the numerous leads on ball grid selection devices and other large incorporated circuit plan formats.

There are usually two types of material utilized to build a multilayer board. Pre-preg material is thin layers of fiberglass pre-impregnated with an adhesive, and is in sheet kind, usually about.002 inches thick. Core material resembles an extremely thin double sided board in that it has a dielectric product, such as epoxy fiberglass, with a copper layer deposited on each side, typically.030 density dielectric product with 1 ounce copper layer on each side. In a multilayer board design, there are two methods used to build up the wanted number of layers. The core stack-up technique, which is an older innovation, uses a center layer of pre-preg material with a layer of core product above and another layer of core product below. This mix of one pre-preg layer and 2 core layers would make a 4 layer board.

The movie stack-up technique, a newer innovation, would have core product as the center layer followed by layers of pre-preg and copper product developed above and listed below to form the final number of layers needed by the board design, sort of like Dagwood building a sandwich. This approach enables the manufacturer flexibility in how the board layer densities are combined to meet the finished product thickness requirements by varying the number of sheets of pre-preg in each layer. Once the material layers are completed, the whole stack is subjected to heat and pressure that causes the adhesive in the pre-preg to bond the core and pre-preg layers together into a single entity.

The procedure of producing printed circuit boards follows the actions listed below for the majority of applications.

The process of identifying materials, procedures, and requirements to meet the client's specifications for the board style based on the Gerber file information provided with the order.

The procedure of transferring the Gerber file information for a layer onto an etch withstand movie that is placed on the conductive copper layer.

The traditional process of exposing the copper and other areas unprotected by the etch resist movie to a chemical that removes the vulnerable copper, leaving the protected copper pads and traces in location; newer processes use plasma/laser etching rather of chemicals to eliminate the copper material, enabling finer line meanings.

The process of lining up the conductive copper and insulating dielectric layers and pressing them under heat to trigger the adhesive in the dielectric layers to form a strong board product.

The procedure of drilling all the holes for plated through applications; a second drilling process is used for holes that are not to be plated through. Info on hole place and size is contained in the drill drawing file.

The process of applying copper plating to the pads, traces, and drilled through holes that are to be plated through; boards are positioned in an electrically charged bath of copper.

This is required when holes are to be drilled through a copper area but the hole is not to be plated through. Avoid this process if possible due to the fact that it includes expense to the ended up board.

The procedure of applying a protective masking material, a solder mask, over the bare copper traces or over the copper that has had a thin layer of solder applied; the solder mask protects versus ecological damage, supplies insulation, safeguards against solder shorts, and safeguards traces that run between pads.

The process of finishing the pad areas with a thin layer of solder to prepare the board for the eventual wave soldering or reflow soldering procedure that will take place at a later date after the parts have been placed.

The process of applying the markings for element designations and component outlines to the board. Might be used to just the top side or to both sides if components are installed on both top and bottom sides.

The procedure of separating numerous boards from a panel of similar boards; this procedure also permits cutting notches or slots into the board if needed.

A visual examination of the boards; also can be the process of checking wall quality for plated through holes in multi-layer boards by cross-sectioning or other techniques.

The procedure of checking for connection or shorted connections on the boards by ways applying a voltage in between different points on the board and figuring out if a present circulation happens. Depending upon the board intricacy, this process may require a specifically designed test fixture and test program to integrate with the electrical test system utilized by the board producer.